【其它测试项目及标准】:ASTM、UL等

【其它测试项目及标准】:ASTM、UL等
测试标准
测试项目（英文描述）
测试项目（中文描述）
ASTM D 149
Dielectric Breakdown Voltage & Strength
固体电绝缘材料在工频下的介电击穿电压和介电强度
ASTM D 229
Bonding Strength
电气绝缘用刚性薄板及板材的粘合强度
ASTM D 229
Dielectric Constant and Dissipation Factor
电气绝缘用刚性薄板及板材的介电常数和介质损耗
ASTM D 229
Flexural Strength (Lengthwise & Crosswise)
电气绝缘用刚性薄板及板材的弯曲强度
ASTM D 256
Izod Impact Test
测定塑料抗艾卓德摆动冲击性
ASTM D 257
DC Resistance of Insulating Materials
绝缘材料的直流电阻或电导率
ASTM D 412
Tensile - Elastomer Properties (Test Method A)
硫化橡胶、热塑橡胶和热塑合成橡胶的拉伸试验法
ASTM D 495
Arc Resistance
固体电气绝缘材料的耐高压小电流电弧性能
ASTM D 570
Water Absorption
塑料吸水率
ASTM D 638
Tensile Properties of Thermoplastic Materials
塑料抗拉特性
ASTM D 648
Deflection Temperature of Polymer Material Under Load
在挠曲负荷下塑料边缘位置弯曲温度的标准测试方法
ASTM D 648
Vicat Softening Point of Polymer Materials
塑料维卡(Vicat)软化温度的标准试验方法
ASTM D 695
Compressive Strength
硬质塑料抗压特性的标准试验方法
ASTM D 790
Flexural Properties of Plastics
未增强和增强塑料及电绝缘材料的挠曲性的标准试验方法
ASTM D 792
Specific Gravity of Polymers
用位移法测定塑料密度和比重(相关密度)的标准试验方法
ASTM D 882
Tensile Strength - Thin Polymeric Sheeting (Bias or Machine Direction)
塑料薄板材抗拉特性的标准试验方法
ASTM D 903
Bond Strength Properties of Adhesives - Peel Strength
胶粘剂抗剥落或剥离强度的试验方法
ASTM D 1002
Bond Strength Properties of Adhesives - Lap Shear
用拉力负载法测定单面搭接粘结金属试样的表面剪切强度(金属之间)
ASTM D 1042
Changes in Linear Dimensions of Polymer Materials
加速操作状态下塑料线性尺寸变化的标准测试方法
ASTM D 1525
Vicat Softening Point of Polymer Materials
塑料维卡(Vicat)软化温度的标准试验方法
ASTM D 1622
Density Determination of Foamed Polymer Material
硬质泡沫塑料表观密度的标准试验方法
ASTM D 1822
Tensile Impact Test
测试断裂塑料及电绝缘材料拉伸冲击能量的试验方法
ASTM D 1830
Thermal Endurance of Flex by Curved Electrode
用弧形电极法测定电绝缘挠性薄片材料热稳定性的标准试验方法
ASTM D 1876
Bond Strength Properties of Adhesives - T-Peel
胶粘剂的抗剥离性的标准试验方法(T 型剥离试验)
ASTM D 2095
Bond Strength Properties of Adhesives - Butt Joint
用棒和条状样品测定胶粘剂抗拉强度的标准试验方法
ASTM D 2584
Ignition Loss of Cured Reinforced Resins
固化的增强树脂燃烧损失的标准试验方法
ASTM D 3039
Tensile Properties of Polymer Matrix Composite Materials
聚合母体混合材料抗拉特性的标准试验方法
ASTM D 3045
Heat Aging of Plastics Without Load
无负荷塑料制品热老化的标准实施规程
ASTM D 3165
Strength Properties of Adhesives in Shear by Tension
用单面搭接迭层板装配件的抗拉荷载法测定胶粘剂抗剪切强度的标准试验方法
ASTM D 3386
Coefficient of Linear Thermal Expansion of ElectricalInsulating Materials
电绝缘材料的线性热膨胀系数的标准试验方法
ASTM D 3418
Differential Scanning Caloritmetry (DSC)
用差示扫描量热法测定聚合物转变温度的标准试验方法
ASTM D 3479
Tension Testing Fatigue of Polymer Matrix Composite Materials
聚合母体混合料拉伸疲劳度的标准试验方法
ASTM D 3638
Comparative Tracking Index (CTI)
电绝缘材料比较漏电痕迹指数的标准试验方法
ASTM D 3846
In-Plane Shear Strength of Reinforced Plastics
增强塑料的平面剪切强度的标准测试方法
ASTM D 3850
Thermal Gravimetric Analysis (TGA)
用热解重量法测定固体电绝缘材料快速热降解的标准试验方法
ASTM D 3874
Hot Wire Ignition (HWI)
用电热丝法测量材料着火性的标准试验方法
ASTM D 5083
Tensile Properties of Reinforced Thermosetting Plastics
用于直边样品的热增强塑料的拉伸性特性的标准试验方法
ASTM B 193
Resistivity of Electrical Conductor Materials
导电体材料电阻率的标准测试方法
ASTM E 8
Tension Testing of Metallic Materials
金属材料拉伸试验的标准试验方法
ASTM E 53
Copper Purity Analysis
用重量分析法测定非合金铜中铜含量的标准试验方法
ASTM E 96
Water Vapor Transmission of Materials
材料的水蒸气渗透性标准试验方法
ASTM E 345
Tension Testing of Metallic Foils
金属箔的抗拉试验方法
ASTM E 1530
Thermal Conductivity
用保护的热流计技术评定材料耐传热性能的标准试验方法
GR-78-CORE
Surface Insulation Resistance (SIR) Telcordia
表面绝缘电阻
IEC 60695-2-11
Glow-Wire Flammability (Ignitability) for End sell 着火危险试验.第 2-11 部分:
灼热金属线/专线的试验方法.ZUI终产品的灼热金属线可燃性试验方法
IEC 60695-2-12
Glow-Wire Flammability for Materials
材料的灼热丝引燃试验方法
IEC-60249
Base Materials for Printed Circuits
印制电路用基材
IEC-60326
Specification for Printed Circuits
印制电路规范
IEC-695-10-2
Ball Pressure Test
球压试验
IPC-4101
Specification for Base Materials for Rigid Multilayer Boards
刚性多层印制电路板基材规范
IPC-4103
Specification for Base Materials for High Speed/High Frequency App.
高速/高频设备的基材规范
IPC-6012
Specification for Rigid Printed Boards
刚性印制板的鉴定与性能规范
IPC-6013
Specification for Flexible Printed Boards
挠性印制板的鉴定与性能规范
IPC-6016
Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连层或板的鉴定和性能规范
IPC-6018
Microwave End Product Board Inspection and Test
微波终端产品板的检验和试验规范
IPC-A-600
Acceptability of Printed Boards
印制板的验收条件
IPC-SM-840
Qualification and Performance of Permanent Solder Mask
永久性阻焊剂的鉴定和性能
IPC-TM-650; Method 2.1.1.2
Microsectional Analysis
晶相切片, 半自动晶相切片设备(预备)
IPC-TM-650; Method 2.1.2
Pinhole Evaluation Dye Penetration Method
针孔评定,干燥渗透法
IPC-TM-650; Method 2.1.5
Surface Examination, Unclad and Metal Clad Material
未覆和覆金属材料表面检查
IPC-TM-650; Method 2.1.6.1
Glass Fabric Weight
纤维布重量
IPC-TM-650; Method 2.1.7
Thread Count
玻璃纤维布线数
IPC-TM-650; Method 2.1.10
Presence of Dicyandiamide Crystals
双氰胺晶体目检
IPC-TM-650; Method 2.1.13
Visual Inspection (Flex)
挠性印制电路材料夹杂物和空洞检验
IPC-TM-650; Method 2.2.1
Mechanical Dimensional Verification
机械结构确认
IPC-TM-650; Method 2.2.4
Dimensional Stability (Flex)
挠性电介质材料的结构稳定性
IPC-TM-650; Method 2.2.12
Thickness of Copper by Weight
铜箔厚度--称重法
IPC-TM-650; Method 2.2.12.1
Overall Thickness and Profile Factor of Copper Foils
加工和未加工过的铜箔的全部厚度和外形因数
IPC-TM-650; Method 2.2.12.2
Weight and Thickness of C
免搬运铜箔的重量和厚度
IPC-TM-650; Method 2.2.12.3
Weight and Thickness of Copper Foils with Etchable Carriers
腐蚀性运输下铜箔质量和厚度的确定
IPC-TM-650; Method 2.2.18
Determination of Thickness of Laminates by Mechanical Measurement
层压板厚度机械测量法
IPC-TM-650; Method 2.2.18.1
Determination of Thickness of Metallic Clad Laminates, Cross-sectional
覆金属层压板厚度测定—横截面法
IPC-TM-650; Method 2.3.1.1
Chemical Cleaning of Metal Clad Laminate
化学处理,材料的相应处理
IPC-TM-650; Method 2.3.1.1
Metal Surfaces Processability
覆金属层压板的化学清洗
IPC-TM-650; Method 2.3.2
Chemical Resistance (Flex)
挠性印制电路材料的耐化学性
IPC-TM-650; Method 2.3.3
Chemical Resistance of Materials
绝缘材料的耐化学性
IPC-TM-650; Method 2.3.4.2
Chemical Resistance of Laminates, Prepreg and Coated Foil sell, by Solvent
Exposure 层压板、半固化片和镀层产品的耐化学性—曝露于溶剂中
IPC-TM-650; Method 2.3.4.3
Chemical Resistance
基材的耐化学性—耐二氯甲烷
IPC-TM-650; Method 2.3.6
Etchability
过硫酸铵蚀刻法
IPC-TM-650; Method 2.3.9
Flammability of Prepreg and Thin Laminate
半固化片和薄层压板的燃烧性
IPC-TM-650; Method 2.3.10
Flammability of Laminate
层压板的燃烧性
IPC-TM-650; Method 2.3.10.1
Flammability of Soldermask on Printed Wiring Laminate
印制电路板用阻焊膜的燃烧性
IPC-TM-650; Method 2.3.15
Purity of Copper Foil
铜箔或镀层的纯度
IPC-TM-650; Method 2.3.16
Resin Content of Prepreg
半固化片的树脂含量—灼烧法
IPC-TM-650; Method 2.3.16.2
Treated Weight of Prepreg
涂胶半固化片的重量
IPC-TM-650; Method 2.3.17
Resin Flow of Prepreg
半固化片的树脂流动度
IPC-TM-650; Method 2.3.17.1
Resin Flow of Resin Coated Films (Flex)
涂胶膜和无支撑涂胶膜的树脂流动度
IPC-TM-650; Method 2.3.17.2
Resin Flow of "No Flow" Prepreg
“不流动”半固化片的树脂流动度
IPC-TM-650; Method 2.3.18
Gel Time of Prepreg
半固化片材料凝胶化时间
IPC-TM-650; Method 2.3.19
Volatile Content of Prepreg
半固化片挥发物含量
IPC-TM-650; Method 2.3.23
Soldermask Cure
热固性阻焊剂的固化(耐久性)
IPC-TM-650; Method 2.3.25
Ionic Cleanliness
表面污染离子的探测和测量
IPC-TM-650; Method 2.3.37
Volatile Content
介质膜粘结剂的挥发物含量
IPC-TM-650; Method 2.3.38
Surface Organic Contaminant Detection Test
表面有机污染物的探测
IPC-TM-650; Method 2.4.1
Adhesion, Tape Testing
附着力—胶带法
IPC-TM-650; Method 2.4.1.1
Adhesion, Marking Paints and Inks
标记油墨的附着力
IPC-TM-650; Method 2.4.1.5
Treatment Transfer (Treatment Integrity)
迁移处理的测定
IPC-TM-650; Method 2.4.1.6
Adhesion, Polymer Coating
聚合物涂层附着力
IPC-TM-650; Method 2.4.2.1
Flexural Fatigue and Ductility, Foil
金属箔的弯曲疲劳和延展性
IPC-TM-650; Method 2.4.3
Flexural Fatigue, Flexible Printed Wiring
挠性印制电路材料的曲挠
IPC-TM-650; Method 2.4.3.1
Flexural Fatigue and Ductility, Flexible Printed Wiring
挠性印制电路材料的弯曲疲劳和延展性
IPC-TM-650; Method 2.4.4
Flexural Strength
层压板弯曲强度(室温下)
IPC-TM-650; Method 2.4.4.1
Flexural Strength (At Elevated Temperature)
层压板弯曲强度(高温下)
IPC-TM-650; Method 2.4.5
Flexural Endurance
挠性印制电路材料折弯试验
IPC-TM-650; Method 2.4.5
Folding Flexibility
挠性印制电路材料折弯试验
IPC-TM-650; Method 2.4.8
Peel Strength of Metallic Clad Laminates
覆金属层压板剥离强度
IPC-TM-650; Method 2.4.8.1
Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)
金属箔剥离强度(薄层压板锁眼试验)
IPC-TM-650; Method 2.4.8.2
Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)
高温下覆金属层压板剥离强度(热液体法)
IPC-TM-650; Method 2.4.8.3
Peel Strength (At Elevated Temperature in Air)
高温下覆金属层压板剥离强度(热空气法)
IPC-TM-650; Method 2.4.8.4
Carrier Release, Thin Copper
铜箔的栽存试验
IPC-TM-650; Method 2.4.9
Peel Strength (Flex)
挠性印制电路材料剥离强度
IPC-TM-650; Method 2.4.9.1
Peel Strength of Flexible Circuits - 11/98
挠性电路剥离强度
IPC-TM-650; Method 2.4.12
Solderability, Edge Dip Method
可焊性—边浸法
IPC-TM-650; Method 2.4.13
Solder Float (Flex)
挠性印制电路材料耐浮焊性
IPC-TM-650; Method 2.4.13.1
Thermal Stress of Laminates
层压板热应力试验
IPC-TM-650; Method 2.4.16
Initiation Tear Strength, Flexible Insulating Materials
挠性绝缘材料初始撕裂强度
IPC-TM-650; Method 2.4.18
Tensile Strength and Elongation @ Elevated Temperature
铜箔的拉伸强度和延伸率
IPC-TM-650; Method 2.4.18.1
Tensile/Elongation/Purity/Ductility
内部镀层拉伸强度和延伸率
IPC-TM-650; Method 2.4.19
Tensile Strength and Elongation, Flexible Printed Wiring Materials
挠性印制电路拉伸强度和延伸率
IPC-TM-650; Method 2.4.21
Bond Strength Test, Unsupported Hole
非支撑孔连接盘粘合强度
IPC-TM-650; Method 2.4.21.1
Bond Strength Test (Surface Mount Lands)
粘合强度—表面贴装盘的垂直拉脱法
IPC-TM-650; Method 2.4.22
Bow & Twist (PCB)
弓曲和扭曲
IPC-TM-650; Method 2.4.22.1
Bow and Twist (Laminate)
层压板的弓曲和扭曲
IPC-TM-650; Method 2.4.24
Thermal Mechanical Analysis (TMA)
玻璃化温度和 Z 向热膨胀—TMA 法
IPC-TM-650; Method 2.4.24.1
Time to Delamination (TMA)
分层时间—TMA 法
IPC-TM-650; Method 2.4.24.3
Glass Transition Temperature of Organic Films
有机膜的玻璃化温度—TMA 法
Glass Transition Temperature and Thermal Expansion of Materials Used In High
IPC-TM-650; Method 2.4.24.5
Density Interconnection (HDI) and Microvias -TMA Method
用于 HDI 和微孔材料的玻璃化温度和热膨胀系数—DMA 法
IPC-TM-650; Method 2.4.25
Differential Scanning Calorimetry (DSC)
玻璃化温度和固化因素—DSC 法
IPC-TM-650; Method 2.4.27.2
Solder Mask Abrasion (Pencil Method)
阻焊膜耐摩擦—铅笔法
IPC-TM-650; Method 2.4.28.1
Adhesion, Solder Resist (Mask), Tape Test Method
阻焊膜附着力—胶带法
IPC-TM-650; Method 2.4.29
Adhesion, Solder Mask, Flexible Circuit
挠性电路阻焊膜附着力
IPC-TM-650; Method 2.4.36
Rework Simulation, Plated Through Holes
模拟返工—金属化孔
IPC-TM-650; Method 2.4.38
Scaled Flow of Prepreg
半固化片比例流动度试验
IPC-TM-650; Method 2.4.39
Dimensional Stability of Laminates
玻璃纤维增强薄层压板尺寸稳定性
IPC-TM-650; Method 2.4.42.3
Wire Bond Pull Strength
导线结合拉脱强度
IPC-TM-650; Method 2.5.1
Arc Resistance
印制电路材料的耐电弧
IPC-TM-650; Method 2.5.3
Current Breakdown, Plated Through Holes
镀通孔的耐电流
IPC-TM-650; Method 2.5.4.1
Conductor Temperature Rise Due to Current Changes in Conductors
导线电流变化期间的温度升高
IPC-TM-650; Method 2.5.5.4
Dielectric Constant and Dissipation Factor of Printed Wiring Board
Material-Micrometer Method 印制电路板材料的介电常数和介质损耗—测微计法
IPC-TM-650; Method 2.5.5.9
Dielectric Constant (Permittivity) & Dissipation Factor (Loss Tangent) 1MHz～1.5GHz
下介电常数和介质损耗—平行板法
IPC-TM-650; Method 2.5.6
Dielectric Breakdown
刚性印制电路材料的介质击穿
IPC-TM-650; Method 2.5.6.1
Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings
聚合阻焊膜和/或保护涂层的介电强度
IPC-TM-650; Method 2.5.6.2
Electric Strength of Printed Wiring Material
印制电路材料的电气强度
IPC-TM-650; Method 2.5.7
Dielectric Withstanding Voltage (DWV)
印制板绝缘强度（DWV）试验
IPC-TM-650; Method 2.5.7.1
Dielectric Withstanding Voltage - Polymeric Conformal Coating
电介质耐电压—聚合保护涂层
IPC-TM-650; Method 2.5.14
Resistivity of Copper Foil
铜箔电阻率
IPC-TM-650; Method 2.5.17
Volume and Surface Resistivity (Flex)
印制电路材料的体积电阻率和表面电阻
IPC-TM-650; Method 2.5.17.1
Volume and Surface Resistivity
电介质材料的体积电阻率和表面电阻率
Volume Resistivity of Conductive Resistance Used in High Density Interconnection
IPC-TM-650; Method 2.5.17.2
(HDI) and Microvias, Two-Wire Method
HDI 和微孔板用传导材料的体积电阻率—双导线法
IPC-TM-650; Method 2.5.27
Surface Insulation Resistance test
半成品印制电路材料的表面绝缘电阻
IPC-TM-650; Method 2.6.1
Fungus Resistance (Non-Nutrient)
印制电路材料的耐霉菌试验
IPC-TM-650; Method 2.6.2
Moisture Absorption, Flexible Printed Wiring
挠性印制电路吸湿性试验
IPC-TM-650; Method 2.6.3
Moisture and Insulation Resistance
印制板的吸湿性和绝缘电阻
IPC-TM-650; Method 2.6.3.1
Moisture and Insulation Resistance - Solder Mask
阻焊膜的吸湿性和绝缘电阻
IPC-TM-650; Method 2.6.3.2
Moisture and Insulation Resistance, Flexible Base Dielectric
挠性绝缘基材的吸湿性和绝缘电阻
IPC-TM-650; Method 2.6.3.3
Surface Insulation Resistance (SIR)
表面绝缘电阻,溶剂
IPC-TM-650; Method 2.6.3.4
Moisture and Insulation Resistance – Conformal Coating
绝缘保护涂层的吸湿性和绝缘电阻
IPC-TM-650; Method 2.6.3.5
Bare Board Cleanliness by Surface Insulation Resistance
用表面绝缘电阻测定裸板清洁度
IPC-TM-650; Method 2.6.3.6
Surface Insulation Resistance - Fluxes – Telecommunications
表面绝缘电阻——微电流法
IPC-TM-650; Method 2.6.5
Physical Shock, Multilayer Printed Wiring
多层印制板的物理冲击
IPC-TM-650; Method 2.6.6
Temperature Cycling, Printed Wiring Board
印制电路板的温度循环
IPC-TM-650; Method 2.6.7
Thermal Shock and Continuity, Printed Board
印制板的热冲击和连续性
IPC-TM-650; Method 2.6.7.1
Thermal Shock--Polymer Solder Mask Coatings
绝缘保护涂层的热冲击
IPC-TM-650; Method 2.6.7.2
Thermal Shock, Continuity and Microsection, Printed Board
印制板的热冲击、连续性和晶相切片
IPC-TM-650; Method 2.6.7.3
Thermal Shock - Soldermask
阻焊膜的热冲击
IPC-TM-650; Method 2.6.8
Thermal Stress, Plated Through-Holes
镀通孔的热应力试验
IPC-TM-650; Method 2.6.8.1
Thermal Stress, Laminate
层压板的热应力试验
IPC-TM-650; Method 2.6.9
Vibration, Rigid Printed Wiring
刚性印制电路的振动试验
IPC-TM-650; Method 2.6.11
Hydrolytic Stability/Aging
阻焊膜的水解稳定性
IPC-TM-650; Method 2.6.14
Resistance to Electrochemical Migration, Solder Mask
耐电迁移——阻焊膜
IPC-TM-650; Method 2.6.14.1
Electrochemical Migration Resistance Test
耐电迁移试验
IPC-TM-650; Method 2.6.16
Pressure Vessel Thermal Stress
环氧玻璃布层压板完整性——压力容器法
IPC-TM-650; Method 2.6.21
Service Temperature of Flexible Printed Wiring
挠性印制电路的工作温度
IPC-TM-650; Method 2.6.25
Conductive Anodic Filament Test (CAF)
阳极丝传导试验（CAF）
J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
电子装配和电气焊接要求
J-STD-002
Solderability Tests for Component Leads, Terminations, and Wires
起断、终端和金属线结构的可焊性试验
J-STD-003
Solderability Tests for Printed Boards
印制板可焊性试验
MIL-P-50884
Printed Wiring Boards, Flexible or Rigid-Flex
挠性和刚-挠性印制线路板
MIL-P-55110
Printed Wiring Boards, Rigid
刚性印制线路板
MIL-PRF-31032
Printed Wiring/Circuit Board Performance Specification
印制线路/电路板性能规范
MIL-PRF-50884
Printed Wiring Boards, Flexible or Rigid-Flex
挠性或刚-挠性印制线路板
MIL-PRF-55110
Printed Wiring Boards, Rigid
刚性印制线路板
MIL-STD-1130
Wirewrap Bit Certification
导线卷绕位的验证
UL 746A
Polymeric Materials - Short Term Properties
聚合物材料——短时性能评定
UL 746B
Polymeric Materials - Long Term Property Evaluations
聚合物材料——长时性能评定
UL 746C
Polymeric Materials - Use in Electronic Equipment Evaluations
电气设备用聚合物材料的评定
UL 746D
Polymeric Materials - Fabricated Parts
聚合物材料——成品零部件
UL 746E
Polymeric Materials - Industrial Laminates and Materials
聚合材料——工业用层压板、纤维缠绕管、硬化纸板及印制线路板用材料
UL 796
Printed Wiring Boards
印制线路板
UL 796F
Flexible Materials Interconnect Constructions
挠性材料互连结构
UL 94
Tests for Flammability of Plastic Materials
各种电气装置和设备中零部件用塑料材料燃烧性试验
WS-6536
Tensile/Elongation/Purity/Ductility
拉伸/ 延伸/纯度/延展性